ACID COPPER


Product Variants:

DYNAPLATE AC-D

Single additive bright acid copper plating process with high levelling and formulated specifically for higher current density plating. The deposit is perfectly suitable for plating on plastic and for subsequent nickel and chrome plating.  This system meets the requirements of Mil-C-14550B and AMS-2418F.


DYNAPLATE AC-S

Ultra-high performance, dye-free addition agent system for bright acid copper plating, which produces exceptionally bright, ductile deposits with low internal stress.  The deposit is perfectly suitable for plating on plastic and for subsequent nickel and chrome plating.  This system meets the requirements of Mil-C14550B and AMS-2418F.