The Dynaplate CNC process produces a bright, uniform smooth copper deposit free from pitting and roughness. It is suitable as undercoat or barrier plating, and can be easily buffed if required.
Dynaplate CNC-AC is a stable liquid concentrated additive for use in cyanide copper and copper alloy plating solutions. Dynaplate CNC-AC will increase the plating rate, improve plate appearance, decrease anode polarization and reduce the operating costs.
DYNAPLATE CNC FS is used to reduce the surface tension of cyanide brass and copper plating solutions that utilize mechanical agitation. It improves surface contact with the plating solution, and reduces drag out.